Apparatus for processing a substrate

Details Apparatus for processing a substrate Apparatus for processing a substrate

2005-11-14

2009-06-09

Hassanzadeh, Parviz (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C156S345430, C118S7230AN

Reexamination Certificate

active

07544270

ABSTRACT:
An apparatus includes a plasma process chamber and a support element capable of supporting a substrate inside the plasma process chamber. At least one plasma control element is placed adjacent to a peripheral portion of the support element such that the plasma control element is capable of influencing a plasma inside the plasma process chamber if an electric field is applied thereto. At least one voltage generator is connected to the plasma control element. The plasma control element is movable inside the process chamber such that it can be set to any of at least two different positions.

REFERENCES:
patent: 5716486 (1998-02-01), Selwyn et al.
patent: 6074488 (2000-06-01), Roderick et al.
patent: 6184489 (2001-02-01), Ito et al.
patent: 6475918 (2002-11-01), Izawa et al.
patent: 6624084 (2003-09-01), Maeda et al.
patent: 6709547 (2004-03-01), Ni et al.
patent: 6726799 (2004-04-01), Koike
patent: 2004/0149389 (2004-08-01), Fink
patent: 2002261084 (2002-09-01), None
patent: 2004050079 (2004-06-01), None

Affiliated with

Also associated with

Rating

Apparatus for processing a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for processing a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for processing a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4145283