Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2008-10-15
2011-10-18
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S010000, C451S011000, C451S044000, C451S059000, C451S303000, C451S307000
Reexamination Certificate
active
08038508
ABSTRACT:
A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.
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Hong Chang-Ki
Lim Jong-Heun
Shin Sung-Ho
Yoon Bo-Un
Lee & Morse P.C.
Morgan Eileen P.
Samsung Electronics Co,. Ltd.
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