Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2007-11-06
2007-11-06
Shakeri, Hadi (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S005000, C451S006000, C451S060000
Reexamination Certificate
active
10601789
ABSTRACT:
A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.
REFERENCES:
patent: 5081796 (1992-01-01), Schultz
patent: RE34425 (1993-11-01), Schultz
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5540810 (1996-07-01), Sandhu et al.
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5716264 (1998-02-01), Kimura et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5738573 (1998-04-01), Yueh
patent: 5855804 (1999-01-01), Walker
patent: 5868609 (1999-02-01), Aaron et al.
patent: 5893753 (1999-04-01), Hempel, Jr.
patent: 5945347 (1999-08-01), Wright
patent: 5951368 (1999-09-01), Watanabe et al.
patent: 5958148 (1999-09-01), Holzapfel et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6068545 (2000-05-01), Arai
patent: 6106662 (2000-08-01), Bibby, Jr. et al.
patent: 6113465 (2000-09-01), Kim et al.
patent: 6120347 (2000-09-01), Sandhu et al.
patent: 6120354 (2000-09-01), Koos et al.
patent: 6142857 (2000-11-01), Cesna
patent: 6162368 (2000-12-01), Li et al.
patent: 6213844 (2001-04-01), Lenkersdorfer
patent: 6217410 (2001-04-01), Holzapfel et al.
patent: 6217411 (2001-04-01), Hiyama et al.
patent: 6220941 (2001-04-01), Fishkin et al.
patent: 6261158 (2001-07-01), Holland et al.
patent: 6283840 (2001-09-01), Huey
patent: 6319098 (2001-11-01), Osterheld et al.
patent: 6334807 (2002-01-01), Lebel et al.
patent: 6354907 (2002-03-01), Satoh et al.
patent: 6361646 (2002-03-01), Bibby, Jr. et al.
patent: 6435942 (2002-08-01), Jin et al.
patent: 6436832 (2002-08-01), Ma et al.
patent: 6443814 (2002-09-01), Miller et al.
patent: 6468135 (2002-10-01), Cruz et al.
patent: 6506097 (2003-01-01), Adams et al.
patent: 6555466 (2003-04-01), Laursen et al.
patent: 6604985 (2003-08-01), Muilenburg et al.
patent: 6616513 (2003-09-01), Osterheld
patent: 6632124 (2003-10-01), Adams et al.
patent: 2002/0023715 (2002-02-01), Kimura et al.
patent: 08-139060 (1996-05-01), None
Hiyama Hirokuni
Ishii Yu
Kimura Norio
Okumura Katsuya
Yano Hiroyuki
Ebara Corporation
Kabushiki Kaisha Toshiba
Shakeri Hadi
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Apparatus for polishing a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for polishing a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for polishing a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3841984