Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent
1994-11-21
1996-04-02
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
257 48, 257734, 257536, 371 211, 371 225, H01L 2166, G01R 3100, G01R 3128
Patent
active
055043690
ABSTRACT:
A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).
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Ballouli Walid S.
Bollish Robert W.
Burton Marcus R.
Carlquist James H.
Dasse Edward C.
Hill Susan C.
Limanek Robert P.
Motorola Inc.
Williams Alexander Oscar
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