Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2008-09-09
2008-09-09
Kackar, Ram N. (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345520, C156S345530, C156S345540, C156S345550, C118S728000, C118S725000, C118S724000, C204S298010, C204S192100
Reexamination Certificate
active
10553843
ABSTRACT:
An apparatus for performing a semiconductor process on a target substrate (W) includes a lifting mechanism (48) disposed in a worktable (38) to assist transfer of the target substrate. The lifting mechanism includes a lifter pin (51) configured to support and move up and down the target substrate, and a guide hole (49) configured to guide the lifter pin being moved up and down. The guide hole includes a main hole portion (49a) which extends through the worktable from its upper surface to lower surface, and an extended hole portion (49b) which extends into an extension sleeve (66) which projects downward from the lower surface of the worktable to correspond to the main hole portion.
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Kackar Ram N.
Tokyo Electron Limited
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