Apparatus for performing jet vapor reduction of the thickness of

Details Apparatus for performing jet vapor reduction of the thickness of Apparatus for performing jet vapor reduction of the thickness of

2000-06-07

2000-12-26

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 69, 438707, 438715, 438726, H01L 2100

Patent

active

061653144

ABSTRACT:
The present invention is directed to a method and apparatus for reducing the thickness of a process layer. The method comprises generating a relatively high velocity gas stream comprised of active ions that will react with the process layer, and moving the wafer relative to the nozzle to effect a reduction in the thickness of the process layer. The apparatus is comprised of a process chamber, means for securing a wafer in the chamber, a nozzle having an exit that is substantially the same width as the diameter of the wafer positioned in the chamber. The apparatus further comprises a means for moving the wafer relative to the nozzle.

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