Apparatus for mounting an electronic part onto a circuit...

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S714000, C029S741000, C029S743000, C029S759000

Reexamination Certificate

active

06931717

ABSTRACT:
A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

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patent: 6519838 (2003-02-01), Okuda et al.
patent: 6519840 (2003-02-01), Stalder
patent: 6530146 (2003-03-01), Link
patent: 11-274240 (1999-10-01), None
patent: 2001-35864 (2001-02-01), None
patent: 2001-60795 (2001-03-01), None

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