Apparatus for mounting an absolute pressure sensor

Details Apparatus for mounting an absolute pressure sensor Apparatus for mounting an absolute pressure sensor

1994-06-29

1995-10-17

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257418, 257419, 257420, 73720, 73721, 73726, 73727, H01L 2984, H01L 2996

Patent

active

054593514

ABSTRACT:
An absolute pressure sensor subassembly includes a top cap bonded to a pressure sensor die and enclosing a reference vacuum. The subassembly is initially held in place within a housing by a vacuum or sublimeable solid adhesive while wire bonds from the subassembly to the housing leads are completed. A self-contained adhesive drop on the inner surface of the housing cover contacts the sensor subassembly when the cover is placed on the housing body and the sensor subassembly is supported by the adhesive drop.

REFERENCES:
patent: 4838089 (1989-06-01), Okada et al.
patent: 5029478 (1991-07-01), Wamstad
patent: 5097841 (1992-03-01), Moriuchi et al.
patent: 5257547 (1993-11-01), Boyer

Affiliated with

Also associated with

Rating

Apparatus for mounting an absolute pressure sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for mounting an absolute pressure sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for mounting an absolute pressure sensor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-599617