Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1998-03-02
2000-07-11
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 565, 118713, B23K 300
Patent
active
060859601
ABSTRACT:
A solder wave height measuring device is provided that may be constructed using a horizontal supporting member that is positioned on a set of conveyors. Perpendicularly attached to the horizontal supporting member is a graduated beam that slidably supports a measuring jacket. The jacket may have a cubic shape, drum shape, or any polyhedron shape, but the jacket will preferably have an upper surface that is perpendicular to the graduated beam to simplify taking visual readings. A surface of the measuring jacket is in contact with the top end of the solder wave to allow the measuring jacket to accurately indicate the height of the solder wave on the graduated beam. Additionally, a fastener can be used to fix the measuring jacket to the graduated beam. The measuring jacket is fixed to the graduated beam by a fastener when the measuring jacket indicates an optimum height to solder at maximum efficiency. This provides an easy and convenient measurement of the solder wave height. Additionally, the apparatus of the present invention is relatively economical due to its low manufacturing cost and simple assembly, the apparatus is easy to operate, few component parts are used, readings can be made visually without requiring operators to bend over into inconvenient positions, the apparatus can be easily maintained in an environment that does not have easy access to high technology components, and the apparatus is easy to operate, repair, and understand by less skilled workers.
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Kim Il-Jin
Park Young-chan
Bushnell Esq. Robert E.
Heinrich Samuel M.
Samsung Electronics Co,. Ltd.
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