Apparatus for measuring of thin dielectric layer properties...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07034563

ABSTRACT:
The invention relates to metrology of thin dielectric layers on semiconductor wafers, interfaces of dielectric layers to the wafer substrates and substrates properties of semiconductor wafers. The invention allows measurement of the metrology data for thin dielectric layers on semiconductor wafers electrically via using contact electrodes that align their contact surface to the wafer surface locally at the measurement sites.

REFERENCES:
patent: 3493858 (1970-02-01), Baron et al.
patent: 3990005 (1976-11-01), Abbe et al.
patent: 4849694 (1989-07-01), Coates
patent: 4992659 (1991-02-01), Abraham et al.
patent: 5266889 (1993-11-01), Harwood et al.
patent: 5453703 (1995-09-01), Goldfarb
patent: 5500607 (1996-03-01), Verkuil
patent: 5642056 (1997-06-01), Nakajima et al.
patent: 6407546 (2002-06-01), Le et al.
patent: 6563308 (2003-05-01), Nagano et al.
patent: 6617865 (2003-09-01), Di Stefano
patent: 6741093 (2004-05-01), Howland et al.
patent: 6815958 (2004-11-01), Kesil et al.
patent: 2004/0155666 (2004-08-01), Kesil et al.
patent: 2004/0196031 (2004-10-01), Nagano

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