Apparatus for measuring a mechanical quantity

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system

Reexamination Certificate

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C073S727000

Reexamination Certificate

active

07430920

ABSTRACT:
An apparatus structure and measurement method are provided to retain high precision and high reliability of a semiconductor mechanical quantity measuring apparatus which senses a mechanical quantity and transmits measured information wirelessly. As to a silicon substrate of the semiconductor mechanical quantity measuring apparatus, for example, a ratio of a substrate thickness to a substrate length along a measurement direction is set small, and a ratio of a substrate thickness to a substrate length along a direction perpendicular to the measurement direction is set small. The apparatus upper surface is covered with a protective member. It is possible to measure a strain along a particular direction and realize mechanical quantity measurement with less error and high precision. An impact resistance and environment resistance of the apparatus itself can be improved.

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Roy et al. “Semiconductor Layering Processes.” J. Webster (ed.) Wiley Encyclopedia of Electrical and Electronics Engineering. 1999. pp. 1-26.
U.S. Appl. No. 11/217,299, T. Sumigawa et al.

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