Apparatus for manufacturing integrated circuit device

Details Apparatus for manufacturing integrated circuit device Apparatus for manufacturing integrated circuit device

2005-06-14

2005-06-14

Mills, Gregory (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C134S001300

Reexamination Certificate

active

06905570

ABSTRACT:
An apparatus includes a chamber for containing a fluid, a guide seated in the chamber, and a transfer robot for loading and/or unloading a plurality of wafers to and/or from the guide. The wafers are located on the guide. The guide has a supporting member for supporting a wafer and a stopper member for preventing the wafer from being inclined over a predetermined range. The stopper member is in contact with a wafer edge disposed at a higher position than a wafer edge supported by the supporting member. A wafer guide has a stopper member to prevent adjacent wafers from being inclined and coming in contact with each other. Therefore, it is possible to suppress a poor drying such as water spots (or watermarks) produced when wafers are adhered to each other in a drying process.

REFERENCES:
patent: 4256229 (1981-03-01), Lee
patent: 5370142 (1994-12-01), Nishi et al.
patent: 5698038 (1997-12-01), Guldi et al.
patent: 5698040 (1997-12-01), Guldi et al.
patent: 5704494 (1998-01-01), Nishikiori et al.
patent: 5845660 (1998-12-01), Shindo et al.
patent: 6616774 (2003-09-01), Sonoda et al.
patent: 62290125 (1987-12-01), None
patent: 10-1998-0012079 (1999-11-01), None
patent: 20-1998-0012729 (2000-02-01), None
patent: 10-1999-0020262 (2001-01-01), None
English Language Abstract of Korean Publication No.: 20-1998-0012729.
English Language Abstract of Korean Publication No. 10-1998-0012079.
English Language Abstract of Korean Publication No. 10-1999-0020262.

Affiliated with

Also associated with

Rating

Apparatus for manufacturing integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for manufacturing integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for manufacturing integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3486975