Apparatus for manufacturing a semiconductor device having a wafe

Details Apparatus for manufacturing a semiconductor device having a wafe Apparatus for manufacturing a semiconductor device having a wafe

1996-12-26

1998-12-01

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

Work support

156345, 20429815, 118723R, C23C 1600

Patent

active

058432370

ABSTRACT:
An apparatus for manufacturing a semiconductor device having a stage for loading a wafer includes: a flat horizontal main surface formed so that the wafer can be fully seated thereon; a perimeter surface formed at an outer portion of the stage and spaced at a predetermined distance from the flat main surface at a height lower than that of the flat main surface; and an annular slope formed between an outer circumference of the flat main surface and an inner circumference of the perimeter surface. The annular slope has a predetermined angle of inclination with respect to the flat main surface. The apparatus prevents the occurrence of plasma buildup and minimizes poor processing uniformity due to the buildup of polymer deposits on the stage.

REFERENCES:
patent: 4854263 (1989-08-01), Chang et al.
patent: 5292554 (1994-03-01), Sinha et al.
patent: 5304248 (1994-04-01), Cheng et al.
patent: 5456757 (1995-10-01), Aruga et al.
patent: 5554266 (1996-09-01), Okamoto
patent: 5695561 (1997-12-01), Tomiyama et al.

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