Apparatus for manufacturing a semiconductor device

Metal working – Barrier layer or semiconductor device making

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79 33R, 79855, B21F 100

Patent

active

052324630

ABSTRACT:
An apparatus for manufacturing a semiconductor device having two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and having one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between the sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

REFERENCES:
patent: 2964831 (1960-12-01), Peterson
patent: 4599636 (1986-07-01), Roberts et al.

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