Apparatus for manufacturing a semiconductor device

Details Apparatus for manufacturing a semiconductor device Apparatus for manufacturing a semiconductor device

1993-08-06

1994-11-08

Ball, Michael

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156578, 118243, 118258, B05C 108

Patent

active

053623541

ABSTRACT:
A dispenser unit is provided on one side of a conveying rail and a wafer is provided on the other side of the conveying rail. A tube is attached at one end to the dispensing unit and at the other end to a syringe. First and second shafts are attached at their base ends to the dispensing unit. A satellite roller and movable roller are mounted on the forward ends of the first and second shafts. The satellite roller and movable roller are mounted such that they are rotatable. A movable mechanism is mounted on the dispensing unit to move a semiconductor element from a wafer onto a lead frame. The movable roller is moved to coat a bonding agent on a rear surface of the semiconductor element.

REFERENCES:
patent: 3958740 (1976-05-01), Dixon
patent: 4569864 (1986-02-01), McIntyre

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