Apparatus for joining a separating adhesive tape

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...

Reexamination Certificate

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C156S379600, C156S583200

Reexamination Certificate

active

07849900

ABSTRACT:
During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

REFERENCES:
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patent: 4870288 (1989-09-01), Abuku et al.
patent: 5009735 (1991-04-01), Ametani et al.
patent: 5254201 (1993-10-01), Konda et al.
patent: 6238515 (2001-05-01), Tsujimoto et al.
patent: 2003/0064592 (2003-04-01), Yamamoto
patent: 2003/0092288 (2003-05-01), Yamamoto et al.
patent: 2005/0205204 (2005-09-01), Kurosawa et al.
patent: 1409380 (2003-04-01), None
patent: 5-63077 (1993-03-01), None
Chinese Office Action for the Application No. 2006100720065 dated Nov. 7, 2008.

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