Apparatus for interlayer planarization of semiconductor material

Details Apparatus for interlayer planarization of semiconductor material Apparatus for interlayer planarization of semiconductor material

1992-01-31

1993-11-02

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51401, 51297, 51283R, B24B 722, B24B 100

Patent

active

052574784

ABSTRACT:
A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.

REFERENCES:
patent: 3499250 (1970-03-01), Jensen et al.
patent: 3504457 (1970-04-01), Jacobsen et al.
patent: 4512113 (1985-04-01), Budinger
patent: 4879258 (1989-11-01), Fisher

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