Apparatus for interconnecting stacked dice on a programmable...

Electronic digital logic circuitry – Multifunctional or programmable – Having details of setting or programming of interconnections...

Reexamination Certificate

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C326S040000

Reexamination Certificate

active

07619441

ABSTRACT:
An apparatus for interconnecting stacked dice on a programmable integrated circuit is described. In one example, an integrated circuit die comprises a programmable integrated circuit that includes first and second interface tiles. The first interface tile is in electrical communication with a first array of pins on the integrated circuit die, and the second interface tile is in electrical communication with a second array of pins on the integrated circuit die. At least one dedicated routing resource is formed on the integrated circuit die between the first interface tile and the second interface tile. The at least one dedicated routing resource is configured to couple at least one pin of the first array of pins to at least one pin of the second array of pins.

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Rahman, Arifur et al., “Die Stacking Technology for Terabit Chip-to-Chip Communications”, Proceedings of 2006 IEEE Custom Integrated Circuits Conference (CICC), Sep. 10-13, 2006, available from IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016-5997.
U.S. Appl. No. 11/973,062, filed Oct. 4, 2007, Rahman, Arifur et al., entitled “Integrated Circuit with Through-Die Via Interface for Die Stacking”, Xilinx, Inc. 2100 Logic Drive, San Jose, CA 95124.

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