Apparatus for interconnecting stacked dice on a programmable...

Details Apparatus for interconnecting stacked dice on a programmable... Apparatus for interconnecting stacked dice on a programmable...

2008-03-03

2009-11-17

Le, Don P (Department: 2819)

Electronic digital logic circuitry

Multifunctional or programmable

Having details of setting or programming of interconnections...

C326S040000

Reexamination Certificate

active

07619441

ABSTRACT:
An apparatus for interconnecting stacked dice on a programmable integrated circuit is described. In one example, an integrated circuit die comprises a programmable integrated circuit that includes first and second interface tiles. The first interface tile is in electrical communication with a first array of pins on the integrated circuit die, and the second interface tile is in electrical communication with a second array of pins on the integrated circuit die. At least one dedicated routing resource is formed on the integrated circuit die between the first interface tile and the second interface tile. The at least one dedicated routing resource is configured to couple at least one pin of the first array of pins to at least one pin of the second array of pins.

REFERENCES:
patent: 6747479 (2004-06-01), Coppola et al.
patent: 6875921 (2005-04-01), Conn
patent: 7062586 (2006-06-01), Donlin et al.
patent: 7068072 (2006-06-01), New et al.
patent: 7135888 (2006-11-01), Hutton et al.
Rahman, Arifur et al., “Die Stacking Technology for Terabit Chip-to-Chip Communications”, Proceedings of 2006 IEEE Custom Integrated Circuits Conference (CICC), Sep. 10-13, 2006, available from IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016-5997.
U.S. Appl. No. 11/973,062, filed Oct. 4, 2007, Rahman, Arifur et al., entitled “Integrated Circuit with Through-Die Via Interface for Die Stacking”, Xilinx, Inc. 2100 Logic Drive, San Jose, CA 95124.

Affiliated with

Also associated with

Rating

Apparatus for interconnecting stacked dice on a programmable... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for interconnecting stacked dice on a programmable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for interconnecting stacked dice on a programmable... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4068806