Optics: measuring and testing – By configuration comparison
Patent
1983-09-20
1986-04-29
Rosenberger, R. A.
Optics: measuring and testing
By configuration comparison
269 73, 356237, G01N 2101
Patent
active
045853517
ABSTRACT:
A hybrid integrated circuit (10), having a plurality of chip carriers (12) mounted thereon, is positioned on a nest (50) of an apparatus (30). An operator, while activating pneumatic switches (58), moves a selected one of the plurality of chip carriers (12) to an inspection site. A sensor plunger (62) detects the presence of the chip carrier (12) and enables a positioning assembly (34), which centers the chip carrier within the inspection site and locks the nest (50), to prevent further movement thereof. A viewing adaptor (70) is then lowered about the selected chip carrier (12) to enable the operator to simultaneously inspect all solder joints (22) positioned beneath the selected chip carrier. Thereafter, the operator releases switch actuator (60) which allows the viewing adaptor (70) to be raised and enables the positioning assembly (34) to unlock the nest (50) so that another chip carrier (12) may be moved to the inspection site for inspection by the operator.
REFERENCES:
patent: 3143791 (1964-08-01), Lanahan et al.
patent: 3471236 (1969-10-01), Pearson
patent: 4028728 (1977-06-01), Sharp
patent: 4274801 (1981-06-01), Herb et al.
patent: 4389669 (1983-06-01), Epstein et al.
"Manual X-Y Wafer Positioner," Cadwallader, IBM Technical Disclosure Bulletin, vol. 25, No. 5, 10/82, p. 2383.
"Integrated Circuit Chip Positioning Tool," Schuelke, IBM Technical Disclosure Bulletin, vol. 13, No. 7, 12/70, p. 2115.
"Chip Alignment Probe," Chiou et al., IBM Technical Disclosure Bulletin, vol. 12, No. 10, 3/70, p. 1547.
Gronek Fred J.
Taradejna Raymond M.
Watkins Ray A.
AT&T - Technologies, Inc.
de Picciotto M.
Julian H. St.
Rosenberger R. A.
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