Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-01-09
2000-05-02
Beck, Shrive
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118723E, 118724, C23C 1600, H05H 100
Patent
active
06056850&
ABSTRACT:
The temperature of a dry etch process of a semiconductor substrate in a plasma etch chamber is controlled to maintain selectivity while also providing a high etch rate by introducing one or more cooling steps into the etch process. To maintain selectivity of the etch as well as a high rate of etch, the formation of plasma is terminated prior to exceeding a predetermined maximum temperature at at least one selected location in the chamber. The temperature at the selected location is reduced prior to the resumption of plasma flow and etching. The plasma etch is then continued, and may optionally be terminated again to permit cooling, as needed, until etching has been completed.
REFERENCES:
patent: 3887407 (1975-06-01), Ono et al.
patent: 4115184 (1978-09-01), Poulsen
patent: 4424621 (1984-01-01), Abbas et al.
patent: 4500563 (1985-02-01), Ellenberger et al.
patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4971653 (1990-11-01), Powell et al.
patent: 5002794 (1991-03-01), Ratner et al.
patent: 5167748 (1992-12-01), Hall
patent: 5213659 (1993-05-01), Blalock et al.
patent: 5286344 (1994-02-01), Blalock et al.
patent: 5290381 (1994-03-01), Nozawa et al.
patent: 5334251 (1994-08-01), Nashimoto
patent: 5346585 (1994-09-01), Doan et al.
patent: 5362666 (1994-11-01), Dennison
patent: 5407531 (1995-04-01), Chiu et al.
patent: 5436172 (1995-07-01), Moslehi
patent: 5446825 (1995-08-01), Moslehi et al.
patent: 5474648 (1995-12-01), Patrick et al.
patent: 5547539 (1996-08-01), Arasawa et al.
patent: 5548470 (1996-08-01), Husain et al.
patent: 5567267 (1996-10-01), Kazama et al.
patent: 5584971 (1996-12-01), Komino
Blalock Guy T.
Howard Bradley J.
Beck Shrive
Hassanzadeh Parviz
Micro)n Technology, Inc.
LandOfFree
Apparatus for improving the performance of a temperature-sensiti does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for improving the performance of a temperature-sensiti, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for improving the performance of a temperature-sensiti will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1591321