Apparatus for improved azimuthal thermal uniformity of a...

Coating apparatus – Gas or vapor deposition – Work support

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE23060, C118S729000, C118S730000

Reexamination Certificate

active

07964038

ABSTRACT:
Methods and apparatus for providing an improved azimuthal thermal uniformity of a substrate are provided herein. In some embodiments, a substrate support for use in a semiconductor process chamber includes a susceptor plate; and a supporting member to support a backside of the susceptor plate proximate an outer edge thereof, wherein the supporting member substantially covers the backside of the susceptor plate. In some embodiments, the substrate support is disposed in a process chamber having at least some lamps disposed below the supporting member and utilized for heating the back side of the susceptor plate.

REFERENCES:
patent: 5044943 (1991-09-01), Bowman et al.
patent: 6156079 (2000-12-01), Ho et al.
patent: 6599815 (2003-07-01), Yang
patent: 2001/0026012 (2001-10-01), Minamitani et al.
patent: 2003/0015141 (2003-01-01), Takagi
patent: 2005/0092439 (2005-05-01), Keeton et al.
patent: 2009/0098280 (2009-04-01), Tahon

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for improved azimuthal thermal uniformity of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for improved azimuthal thermal uniformity of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for improved azimuthal thermal uniformity of a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2638662

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.