Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1991-11-07
1993-09-28
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118724, 118723I, 156643, 20429809, 20429833, H01L 2100
Patent
active
052483703
ABSTRACT:
A method for heating or cooling a semiconductor wafer in semiconductor processing apparatus is described which comprises directing into contact with a surface of the wafer at least a portion of one or more components of the process gas to transfer heat between the wafer and a wafer support positioned in the apparatus adjacent to the wafer. Method and apparatus are also described for controlling the total flow of process gas through the apparatus and for monitoring the pressure in said apparatus to maintain the desired pressure therein.
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Crockett Richard H.
Tsui Chiu-Wing
Applied Materials Inc.
Goudrean George
Hearn Brian E.
Morris Birgit E.
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