Apparatus for heat-treating wafer by light-irradiation and devic

Details Apparatus for heat-treating wafer by light-irradiation and devic Apparatus for heat-treating wafer by light-irradiation and devic

1991-10-11

1994-05-24

Paschall, Mark H.

Electric heating

Heating devices

With power supply and voltage or current regulation or...

21912143, 219494, 392418, 437248, 437173, H05B 102, H01L 2100, H01L 2102

Patent

active

053150929

ABSTRACT:
A temperature measuring device for measuring the temperature of a wafer heated by light irradiation includes: a sheath thermocouple for detecting the temperature of a wafer to be measured by contacting the wafer to be measured; and a covering member for covering the surface of the sheath thermocouple. The surface of the covering member is flat in a predetermined region, and the part in the region can plane-contact the surface of the wafer. Thus, the temperature of the wafer can be measured accurately and in a stable manner, and the wafer surface is free from contamination with adhesives or the metal of the thermocouple.

REFERENCES:
patent: 4924073 (1990-05-01), Chiba
patent: 4981815 (1991-01-01), Kakoschke
patent: 5061444 (1991-10-01), Nazuroff et al.

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