Apparatus for gringing a semiconductor wafer while removing dust

Details Apparatus for gringing a semiconductor wafer while removing dust Apparatus for gringing a semiconductor wafer while removing dust

1995-05-15

1996-08-13

Kisliuk, Bruce M.

Abrading

Machine

Rotary tool

451 41, 451285, 451450, 1566361, 1566451, 437228, 134902, 134153, 134148, B24B 500

Patent

active

055450768

ABSTRACT:
An apparatus for polish-grinding a semiconductor wafer which assuredly removes contaminant dusts from the polished wafer includes a grinding device for polishing a surface of the wafer. The grinding device has a chuck table on which the wafer is laid, a grinding wheel for grindingly polishing the wafer, and means for supplying water to the wafer. The means for supplying water provides water to region of contact between the grinding wheel and the wafer. The apparatus also includes a cleaning device for cleaning any remaining dust on the wafer, having a spin chuck table for rotating the polished wafer, means for supplying a detergent to the polished wafer. The means for supplying the detergent injects the detergent on the surfaces of the polished wafer. The apparatus also includes a controller for controlling the grinding device and the cleaning device. Accordingly, the apparatus according to the present invention can prevent dust from being suctioned to the front side of a wafer, and can remove dust during and after a wafer-grinding process.

REFERENCES:
patent: 3342652 (1967-09-01), Reisman et al.
patent: 4064885 (1977-12-01), Dussault et al.
patent: 4092176 (1978-05-01), Kozai et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5348033 (1994-09-01), Levit
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5483717 (1996-01-01), Chikaki

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