Apparatus for forming materials

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438708, 438781, H01L 2144

Patent

active

061502650

ABSTRACT:
Semiconductor fabrication methods for processing materials on a semiconductor wafer are disclosed. An exemplary method the semiconductor fabrication apparatus comprises processing a material on a semiconductor assembly during semiconductor fabrication, by the steps of: precleaning a semiconductor assembly in ultraviolet radiation, the step of precleaning performed prior to the step of forming; forming a film in ultraviolet radiation and infrared radiation; annealing the film ultraviolet light radiation and infrared radiation.

REFERENCES:
patent: 4246298 (1981-01-01), Guarnery et al.
patent: 4558660 (1985-12-01), Nishizawa et al.
patent: 4699689 (1987-10-01), Bersin
patent: 5268201 (1993-12-01), Komaki et al.
patent: 5449799 (1995-09-01), Terfloth et al.
patent: 5510158 (1996-04-01), Hiramoto et al.
patent: 5531857 (1996-07-01), Engelsberg et al.
patent: 5580421 (1996-12-01), Hiatt et al.
patent: 5658417 (1997-08-01), Watanabe et al.
patent: 5990006 (1999-11-01), Thakur
"How Rapid Isothermal Processing Can Be a Cominant Semiconductor Processing Technology in the 21.sup.st Century" Mat. Res. Soc. Symp. Proc. vol. 429, 1996 Materials Research Society, pp. 81-94.
"Development Trends in Rapid Isothermal Processing (RIP) Dominated Semiconductor Manufacturing"--R. Singh, Department of Electrical and Computer Engineering Clemson University, pp. 31-42.
"Metalorganic Chemical Apor Deposition (MOCVD) of Oxides for Electronic and Photonic Applications"--The Minerals, Metals & Materials Society, 1995, pp. 211-220.
"UV-O.sub.3 and Dry-O.sub.2 : Two-Step Annealed Chemical Vapor-Deposited Ta.sub.2 O.sub.5 Films for Storage Dielectrics of 64-Mb DRAM's"--IEEE Transactions on Electron Devices, vol. 38, No. 3, Mar.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for forming materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1256652

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.