Apparatus for forming grooves on a wafer by use of a laser

Details Apparatus for forming grooves on a wafer by use of a laser Apparatus for forming grooves on a wafer by use of a laser

1975-11-12

1976-11-09

Truhe, J. V.

Electric heating

Metal heating

By arc

29583, B23K 2700, 2 9

Patent

active

039912965

ABSTRACT:
An apparatus for forming grooves in a semiconductor wafer by the use of a laser beam includes a movable stage on which the wafer is mounted and a transparent member mounted on the stage in a sealed manner and covering the wafer. A liquid is introduced into the space defined between the wafer and the transparent member.

REFERENCES:
patent: 3028469 (1962-04-01), Bognar
patent: 3118406 (1964-01-01), Stanton
patent: 3560258 (1971-02-01), Brisbane
patent: 3768157 (1973-10-01), Buie
patent: 3816700 (1974-06-01), Weiner et al.
patent: 3850698 (1974-11-01), Mallozzi et al.
patent: 3866398 (1975-02-01), Vernon, Jr. et al.

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