Apparatus for forming films on a substrate

Details Apparatus for forming films on a substrate Apparatus for forming films on a substrate

1997-08-15

1999-12-14

Dang, Thi

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

427569, 118723E, 118729, C23C 1600

Patent

active

060014326

ABSTRACT:
An apparatus for forming films on a substrate is described. The apparatus comprises a vacuum chamber, an evacuating system connected to the vacuum chamber for maintaining a predetermined pressure in the vacuum chamber, a power supply for generating electric energy at high frequencies, a first electrode disposed in the vacuum chamber and connected to the power supply for receiving the electric energy as a cathode, the substrate to be coated being mounted on the first electrode, a second electrode disposed in the vacuum chamber and grounded as an anode, an electric discharging region being formed between the first and second electrodes in order to generate a plasma region therebetween, and a gas feeding system connected to the vacuum chamber for feeding a reactive gas into the vacuum chamber through a gas outlet port formed on the second electrode. The first and second electrodes are located apart from each other by a distance of no wider than 10 mm thereby a high intensity plasma region is formed to make it possible to improve the deposition speed.

REFERENCES:
patent: 4534816 (1985-08-01), Chen
patent: 4578559 (1986-03-01), Hijikata
patent: 4663828 (1987-05-01), Hanak
patent: 4707210 (1987-11-01), Misumi
patent: 4910041 (1990-03-01), Yanagihara
patent: 4920917 (1990-05-01), Nakatani
patent: 4991542 (1991-02-01), Kohmura
patent: 5022979 (1991-06-01), Hijkata
patent: 5203924 (1993-04-01), Mitani
patent: 5266116 (1993-11-01), Fujioka
patent: 5413673 (1995-05-01), Fujimoto
Wolf, Silicon Processing for the VLSI Era, vol. 1, Lattice Press, 1986, pp. 172-173, 544, 570-571.

Affiliated with

Also associated with

Rating

Apparatus for forming films on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for forming films on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming films on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-860926