Apparatus for forming deposited film

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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C118S715000

Reexamination Certificate

active

06877458

ABSTRACT:
To provide an apparatus for forming a deposited film, which is a parallel plate electrode type CVD apparatus, with a discharge vessel receiving a material gas flowing therein and discharging air therefrom, decomposing the material gas by the aid of a plasma generated therein, and depositing the film on the substrate, in which the exhaust port of the material gas exhaust means has an opening wider in the lateral direction than the parallel plate electrode. This structure diminishes the stagnant region of the material gas during the deposited film forming process and controls formation of by-products, to deposit the film uniform in quality and thickness.

REFERENCES:
patent: 4400409 (1983-08-01), Izu et al.
patent: 4479369 (1984-10-01), Sando et al.
patent: 4841908 (1989-06-01), Jacobson et al.
patent: 4883560 (1989-11-01), Ishihara
patent: 4969416 (1990-11-01), Schumaker et al.
patent: 4998968 (1991-03-01), Misumi
patent: 5266116 (1993-11-01), Fujioka et al.
patent: 5468521 (1995-11-01), Kanai et al.
patent: 5575855 (1996-11-01), Kanai et al.
patent: 5792272 (1998-08-01), van Os et al.
patent: 5948704 (1999-09-01), Benjamin et al.
patent: 6380684 (2002-04-01), Li et al.
patent: 11-251612 (1999-09-01), None

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