Apparatus for forming a photoresist film in a semiconductor devi

Details Apparatus for forming a photoresist film in a semiconductor devi Apparatus for forming a photoresist film in a semiconductor devi

1997-06-19

2000-07-18

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430322, 427240, 427348, 118 52, 118 63, G03F 716, G03C 174

Patent

active

060905212

ABSTRACT:
The method of forming a photoresist film in a semiconductor according to the present invention comprises a first step for coating a photoresist on a wafer, a second step for dispersing a nitrogen gas of high pressure on the wafer to eliminate microscopic riffle waves, pin holes, and peeling portions formed on the surface of the photoresist film, a third step for dispersing a dried nitrogen gas of high temperature to remove a solvent contained within the photoresist film and bake the photoresist film.

REFERENCES:
patent: 5120634 (1992-06-01), Kobayashi
patent: 5536534 (1996-07-01), Bae

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