Apparatus for forming a dielectric layer

Details Apparatus for forming a dielectric layer Apparatus for forming a dielectric layer

1995-06-05

1996-10-01

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118723R, C23C 1600

Patent

active

055607780

ABSTRACT:
A deposition rate of a dielectric material is varied with the electrical polarity of an underlying layer to obtain excellent deposition and planarization characteristics. A conductive layer and the underlying dielectric are surface-treated to have different electrical polarities so that the dielectric is formed by using the difference of deposition rates of the dielectric material between that on the conductive layer and that on the underlying dielectric. A CVD apparatus having a DC power source connected between a susceptor and a gas injection portion thereof is provided. The deposition and planarization can be performed at low temperatures and are simplified in process.

REFERENCES:
patent: 5110619 (1992-05-01), Ogumi et al.
patent: 5221416 (1993-06-01), Kishi et al.
patent: 5366555 (1994-11-01), Kelly
patent: 5456757 (1995-10-01), Aruga et al.

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