Apparatus for effecting reliable heat transfer of bare die...

Details Apparatus for effecting reliable heat transfer of bare die... Apparatus for effecting reliable heat transfer of bare die...

2008-03-04

2008-03-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S711000, C257S718000, C257S719000, C257SE23084, C257SE23094, C361S707000, C361S709000, C174S548000

Reexamination Certificate

active

11013151

ABSTRACT:
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

REFERENCES:
patent: 5883782 (1999-03-01), Thurston et al.
patent: 6519154 (2003-02-01), Chiu

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