Apparatus for edge polishing uniformity control

Details Apparatus for edge polishing uniformity control Apparatus for edge polishing uniformity control

2006-01-31

2006-01-31

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S307000

Reexamination Certificate

active

06991512

ABSTRACT:
An invention is provided for a platen for use in a CMP system. The platen includes an inner set of pressure sub regions capable of providing pressure to a polishing pad disposed above the platen. Each of the inner pressure sub regions is disposed below a wafer and within a circumference of the wafer. In addition, the platen includes an outer set of pressure sub regions capable of providing pressure to a polishing pad. Each of the outer set of pressure sub regions is disposed below the wafer and outside the circumference of the wafer. In this manner, the outer set of pressure sub regions is capable of shaping the polishing pad to achieve a particular removal rate.

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