Apparatus for detaching a semiconductor chip from a tape

Details Apparatus for detaching a semiconductor chip from a tape Apparatus for detaching a semiconductor chip from a tape

2007-05-30

2009-12-01

Banks, Derris H (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S426100, C029S426300, C029S721000, C029S762000, C438S464000

Reexamination Certificate

active

07624498

ABSTRACT:
An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

REFERENCES:
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 5589029 (1996-12-01), Matsui et al.
patent: 6202292 (2001-03-01), Farnworth et al.
patent: 6629553 (2003-10-01), Odashima et al.
patent: 2005/0274457 (2005-12-01), Cheung et al.
patent: 2003-124290 (2003-04-01), None
patent: 1020050111946 (2005-11-01), None

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