Apparatus for cutting tie bars of semiconductor packages

Details Apparatus for cutting tie bars of semiconductor packages Apparatus for cutting tie bars of semiconductor packages

1998-03-20

2000-05-23

Rada, Rinaldi I.

Cutting

With product handling means

By fluid current

83686, 839291, 839292, B26D 718

Patent

active

060653817

ABSTRACT:
An apparatus for cutting tie bars of semiconductor packages unloads the semiconductor packages by continuously blowing air against the side of the packages after the tie bars are cut and the semiconductor packages are separated from lead frames. The packages are blown into a guide track which feeds into a storage tube. As a result, damage to the packages due to mechanical abrasion which may result from unloading with a pusher bar is prevented. Furthermore, the time required for unloading the semiconductor packages is reduced.

REFERENCES:
patent: 1174349 (1916-03-01), Reynolds
patent: 2442901 (1948-06-01), Missbach
patent: 4187751 (1980-02-01), Barnacle
patent: 4628780 (1986-12-01), Hicks
patent: 4836071 (1989-06-01), Ersoy
patent: 5096108 (1992-03-01), Kuze

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