Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Patent
1997-04-24
1999-03-30
Coe, Philip R.
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
134153, 134902, B08B 302
Patent
active
058876057
ABSTRACT:
A semiconductor wafer cleaning apparatus is disclosed including a cleaning solution supply line for supplying a cleaning solution to a surface of a wafer, one end of which is connected to a cleaning solution supply source. A gas supply line is connected to a gas supply source to supply a gas to the surface of the wafer. A nozzle assembly is connected to respective second ends of the cleaning solution supply line and the gas supply line, the nozzle assembly having a spray nozzle facing the surface of the wafer, wherein the cleaning solution and gas supplied are mixed in the nozzle assembly.
REFERENCES:
patent: 2960710 (1960-11-01), McKeegan
patent: 3012921 (1961-12-01), Vaughan
patent: 3188238 (1965-06-01), Lyon
patent: 3297257 (1967-01-01), Roser
patent: 4941490 (1990-07-01), Gross
patent: 4976810 (1990-12-01), Masuda et al.
patent: 5351360 (1994-10-01), Suzuki et al.
Kim Byung-jin
Lee Je-cheol
Coe Philip R.
Samsung Electronics Co,. Ltd.
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