Apparatus for chemical etching of a wafer material

Details Apparatus for chemical etching of a wafer material Apparatus for chemical etching of a wafer material

1983-01-24

1983-11-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156654, 156662, H01L 21306

Patent

active

044179456

ABSTRACT:
An apparatus is provided for chemically etching, for example, a semiconductor wafer material in an etching solution to remove the surface strain caused by mechanical working such as lapping and polishing. The apparatus comprises a disk rotatable around an axis in the solution and provided on the surface with groove-like liquid flow channels and a means for holding the wafer closely side-by-side to face the rotatable disk and the rotatable disk and the wafer are each rotated around its own axis with simultaneous reciprocative movement of the wafer along a radial direction of the disk so that very high degree of uniformity is ensured in the etching effect on the wafer surface.

REFERENCES:
patent: 2328533 (1943-08-01), Walker
patent: 3549439 (1970-12-01), Kaveggia et al.

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