Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With etchant gas supply or exhaust structure located outside...
Reexamination Certificate
2006-01-09
2009-02-17
Hassanzadeh, Parviz (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With etchant gas supply or exhaust structure located outside...
Reexamination Certificate
active
07491292
ABSTRACT:
An apparatus for catching byproducts in semiconductor device processing equipment is disposed in an exhaust line between a process chamber and a vacuum pump. The apparatus includes a cylindrical trap housing member, an upper cover and a lower cover covering the upper part and lower part of the trap housing, respectively, a heater disposed under the upper cover, first and second cooling plates disposed in the trap housing, a post spacing the cooling plates, apart and a cooling system for cooling respective portions of the apparatus. The cooling system includes a delivery pipe for supplying refrigerant, a discharge pipe for discharging the refrigerant from the apparatus, first cooling piping extending through each cooling plate and connected to the delivery and discharge pipes, and second cooling piping extending helically along the outer circumferential surface of the trap housing.
REFERENCES:
patent: 1080445 (1913-12-01), Hey
patent: 2984314 (1961-05-01), Denton
patent: 3697748 (1972-10-01), Cohen
patent: 3731392 (1973-05-01), Gottfried
patent: 4178697 (1979-12-01), Sutherland
patent: 5810077 (1998-09-01), Nakamura et al.
patent: 5966353 (1999-10-01), Kaneko et al.
patent: 6206971 (2001-03-01), Umotoy et al.
patent: 6447158 (2002-09-01), Farkas
patent: WO 00/51702 (2000-09-01), None
Bae Do-In
Han Jung-Hun
Park Jin-Jun
Chen Keath
Hassanzadeh Parviz
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
LandOfFree
Apparatus for catching byproducts in semiconductor device... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for catching byproducts in semiconductor device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for catching byproducts in semiconductor device... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4126030