Apparatus for bonding wafer pairs

Details Apparatus for bonding wafer pairs Apparatus for bonding wafer pairs

1995-02-08

1996-08-13

Yoder, Michele K.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

156285, 156286, 1565833, 269 21, 269 22, B32B 3120

Patent

active

055452833

ABSTRACT:
An apparatus and method for bonding wafer pairs. The apparatus includes a heated platen surrounded by a pressurization vessel. The heated platen includes channels connected to a hole which runs through the heated platen. Wafer pairs are placed on the top surface of the platen, a rubber mat is placed over the top of the wafer pairs, and a vacuum is drawn through the hole and the channels. The rubber mat compresses the wafer pairs. The platen is heated for the bonding process. The pressurization chamber is pressurized supplying additional bonding pressure to the wafer pair. Once sufficiently heated, the heated platen is liquid cooled completing the bonding process.

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