Apparatus for bonding semiconductor wafers

Details Apparatus for bonding semiconductor wafers Apparatus for bonding semiconductor wafers

1996-09-27

1998-05-05

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156581, 1565838, B32B 3100, H01L 2100

Patent

active

057468834

ABSTRACT:
An apparatus for bonding semiconductor wafers firmly bonds the wafers to each other and can always lay the bonded wafers on a desired bonding plate. The bonding plates have a plurality of grooves formed on their respective surfaces to reduce the bond force between the wafers and the bonding plates of the apparatus, and to prevent the wafers from sliding off the plates due to an air cushion. An interval controlling pin projects from the surface of one of the bonding plates to reduce breakage of the wafers by maintaining an interval between the bonding plates as they are are rotated towards each other. An elastic pad portion is installed on one the bonding plates for providing an elastic force for the wafers placed on the bonding plates so that the wafers bond to each other properly when the bonding plates are further rotated towards each other.

REFERENCES:
Haisma, J., et al. "Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological Evaluations,"Japanese Journal of Applied Physics, Vol. 28, No. 8, Aug. 1989, pp. 1426-1443.

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