Apparatus for automatically positioning electronic dice...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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C324S1540PB, C324S754090, C438S010000, C438S011000, C438S012000, C438S013000, C438S015000, C438S016000, C438S017000, C438S018000

Reexamination Certificate

active

06900459

ABSTRACT:
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

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