Apparatus for applying secondary layer on board surface

Paper making and fiber liberation – Apparatus – Running or indefinite length product forming and/or treating...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

162305, 162351, D21H 106

Patent

active

040897400

ABSTRACT:
Method and apparatus for applying a secondary layer or coating on surfaces of wet formed board materials are disclosed. The secondary layer is applied to the wet mat material of the board being manufactured during press rolling of the wet mat. The secondary layer material is supplied in the form of a slurry which is caused to adhere to the surface of a wire screen. The wire screen surface bearing the layer of slurry material is then pressed onto the mat surface to deposit the slurry layer thereon.

REFERENCES:
patent: 3270476 (1966-09-01), Ensled et al.
patent: 3350260 (1967-10-01), Johnson
patent: 3681193 (1972-08-01), Nykopp
patent: 3775244 (1973-11-01), Hubschmann
patent: 3905864 (1975-09-01), Curry et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for applying secondary layer on board surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for applying secondary layer on board surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for applying secondary layer on board surface will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1196188

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.