Apparatus for annealing, method for annealing, and method...

Details Apparatus for annealing, method for annealing, and method... Apparatus for annealing, method for annealing, and method...

2008-09-17

2011-12-13

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Introduction of conductivity modifying dopant into...

C438S509000, C438S535000, C257SE21170, C257SE21051, C257SE21134, C257SE21328, C257SE21347

Reexamination Certificate

active

08076226

ABSTRACT:
An apparatus for annealing a substrate includes a substrate stage having a substrate mounting portion configured to mount the substrate; a heat source having a plurality of heaters disposed under the substrate mounting portion, the heaters individually preheating a plurality areas defined laterally in the substrate through a bottom surface of the substrate; and a light source facing a top surface of the substrate, configured to irradiate a pulsed light at a pulse width of about 0.1 ms to about 100 ms on the entire top surface of the substrate.

REFERENCES:
patent: 4059461 (1977-11-01), Fan et al.
patent: 4151008 (1979-04-01), Kirkpatrick
patent: 5620905 (1997-04-01), Konuma et al.
patent: 7060581 (2006-06-01), Ito et al.
patent: 7442625 (2008-10-01), Ito
patent: 2003/0193066 (2003-10-01), Ito et al.
patent: 2004/0018702 (2004-01-01), Ito et al.
patent: 2004/0259302 (2004-12-01), Ito et al.
patent: 2005/0063448 (2005-03-01), Kusuda
patent: 2006/0216875 (2006-09-01), Ito et al.
patent: 2006/0225657 (2006-10-01), Mizushima et al.
patent: 2006/0291835 (2006-12-01), Nozaki et al.
patent: 3-23629 (1991-01-01), None
patent: 2002-57301 (2002-02-01), None
patent: 2002-252174 (2002-09-01), None
patent: 2004-303921 (2004-10-01), None
patent: 2005-136395 (2005-05-01), None
Notification of Reasons for Refusal issued by the Japanese Patent Office on Jun. 14, 2011, for Japanese Patent Application No. 2005-188209, and English-language translation thereof.

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