Apparatus for and method of processing substrate

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S018000, C134S033000, C134S042000

Reexamination Certificate

active

07578887

ABSTRACT:
An apparatus for processing a substrate through successive steps including spin-drying the substrate with a single processing facility while preventing the substrate from being contaminated by a substrate processing liquid, etc. The apparatus for processing a substrate includes a substrate holder for holding and rotating a substrate, a scattering prevention cup for circumferentially surrounding the substrate held by the substrate holder to prevent a substrate processing liquid supplied to the substrate from being scattered around, and a scattering prevention cup cleaner for cleaning an inner wall surface of the scattering prevention cup.

REFERENCES:
patent: 5252137 (1993-10-01), Tateyama et al.
patent: 5634980 (1997-06-01), Tomita et al.
patent: 5826130 (1998-10-01), Tanaka et al.
patent: 5945161 (1999-08-01), Hashimoto et al.
patent: 6090534 (2000-07-01), Costigan et al.
patent: 6192903 (2001-02-01), Doi et al.
patent: 6265328 (2001-07-01), Henley et al.
patent: 6413436 (2002-07-01), Aegerter et al.
patent: 6432199 (2002-08-01), Takekuma
patent: 6705331 (2004-03-01), Sato et al.
patent: 6843259 (2005-01-01), Nagamine
patent: 6945259 (2005-09-01), Masui et al.
patent: 6-106126 (1994-04-01), None
patent: 10-172945 (1998-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for and method of processing substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for and method of processing substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for and method of processing substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4072729

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.