Apparatus for and method of cleaning objects to be processed

Details Apparatus for and method of cleaning objects to be processed Apparatus for and method of cleaning objects to be processed

1997-09-24

2000-04-04

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 951, 134 61, 134902, 134 26, 134 21, 15302, B08B 300

Patent

active

060456248

ABSTRACT:
A cleaning apparatus and a cleaning method for restricting an occurrence of water marks on a surface of a object to be processed are provided. The cleaning apparatus is constructed so as to dry wafers W, which have been rinsed by DIW in a drying chamber 42, in a cooling system. Thus, the reaction between, for example, IPA, DIW etc. and silicon in surfaces of the wafers W is inactivated to cause the surfaces to be oxidized with difficulty, so that it is possible to restrict the occurrence of the water marks on the surfaces.

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Koppenbrink et al, Particle Reduction on Silicon Wafers as a Result of Isopropyl Alcohol Vapor Displacement Drying After Wet Processing, Particles on Surface 2, Plenum Press, pp. 235-243, 1989.

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