Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1994-03-15
1995-12-05
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
156494, 156495, 156496, 156510, 156522, 156543, 156552, 156555, 156250, 156229, B32B 3500, B32B 3110, B32B 3118
Patent
active
054725542
ABSTRACT:
A masking film adhering method and apparatus for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.
REFERENCES:
patent: 4680079 (1987-07-01), Tanaka
patent: 4865677 (1989-09-01), Matsushita et al.
patent: 5310442 (1994-05-01), Ametani
An Woung-kwan
Kim Chul-hee
Kim Il-ho
Ko Kyoun-hee
Mayes M. Curtis
Samsung Electronics Co,. Ltd.
Simmons David A.
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