Apparatus and system for eliminating contaminants on a...

Coating apparatus – Gas or vapor deposition – Multizone chamber

Reexamination Certificate

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C118S715000, C118S724000

Reexamination Certificate

active

06855207

ABSTRACT:
An intergrated closed apparatus and system for eliminating contaminants including metallic and/or hydrocarbon-containing contaminants on a surface of a semiconductor substrate. The apparatus and system include a heating chamber for heating the contaminated substrate to an elevated temperature, and an input line for purging the chamber with a chlorine-containing gas. The chlorine dissociates from the chlorine-containing gas, reacts with the contaminates, and forms volatile chloride byproducts which are removed from the heating chamber via an output line. A cooling chamber of the apparatus and system having an input line for providing a gas therein cools the substrate. A workpiece holds the substrate, which in turn, is held in position by a pedestal. The pedestal is in contact with a door that seals the closed apparatus and system, whereby the door transfers the substrate from the heating chamber to the cooling chamber, and vice versa.

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Dry Wafer Cleaning by Use of a Reducing Plasma, J. E. Drew, IBM Technical Disclosure Bulletin, vol. 34, No. 4A, Sep. 1991, p. 226.

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