Apparatus and process for the production of fine line metal trac

Details Apparatus and process for the production of fine line metal trac Apparatus and process for the production of fine line metal trac

1993-05-06

1994-11-15

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156652, 156656, 156668, 156345, 156902, 156643, 21912169, B44C 122, C23F 100, B29C 3700

Patent

active

053644930

ABSTRACT:
A metallic substrate such a copper foil has an etch barrier such polyimide, Saran Wrap.RTM., or other plastic applied. This barrier is thereafter selectively etched or ablated with a laser, for example by passing the light through a phase reticle or phase mask having at least the image information for the fine metallic lines thereon. The remaining barrier then acts in a second etch process to remove the underlying metallic layer. A wet or dry (such as RIE) etch may be employed. Over conventional photoresist exposure methods, the developer and resist steps are eliminated. The laser can precisely pattern the barrier in a single step with the remainder of the production of the required metallic fine lines relying on a simple wet etch, a process whose control parameters are well understood and consume little time. Alternately, a process for the direct ablation of metallic layers is disclosed.

REFERENCES:
patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4786358 (1988-11-01), Yamazaki et al.
patent: 4842677 (1989-06-01), Wojnarowski et al.
patent: 4915981 (1990-04-01), Traskos et al.
patent: 4940508 (1990-07-01), Shamouilian et al.

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