Apparatus and process for producing thin films and devices

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S787000, C438S791000, C257SE21293, C118S715000, C118S724000

Reexamination Certificate

active

07871940

ABSTRACT:
A silicon nitride thin film formation apparatus is provided for stationary and moving substrates and a process for forming such films. The process provides high uniformity of film thickness and film properties as well as a high deposition rate. The film properties are adequate for application as an antireflection layer or passivation layer in solar cell devices or as dielectric layer in thin film transistors. The apparatus includes a number of metal filaments. In the space within the formation apparatus opposite to the substrate with respect to the filaments, a gas dosage system is arranged at a predetermined distance of the filaments. The film formation apparatus for stationary substrates also contains a shutter to control the starting and ending conditions for film formation and to control the film thickness.

REFERENCES:
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patent: 6432206 (2002-08-01), Tolt
patent: 7300890 (2007-11-01), Wang
patent: 2001/0052596 (2001-12-01), Meiling et al.
patent: WO 98/28463 (1998-07-01), None
Sato Hidekazu et al., “Ultrathin Silicon Nitride Gate Dielectrics Prepared By Catalytic Chemical Vapor Deposition At Low Temperatures” Applied Physics Letters, Amercan Institute of Physics. vol. 77, No. 17, p. 2752-2754, © 2000.
A. Kikkawa et al., “Electrical Properties of Silicon Nitride Films Deposited by Catalytic Chemical Vapor Deposition on Catalytically Nitrided Si(100)” Thin Solid Films Sequoia, vol. 430, No. 1-2, p. 100-103, © 2003.
H Sato et al., “Low-k Silicon Nitride Film for Cooper Interconnects Process Prepared by Catalytic Chemical Vapor Deposition Method at Low Temperature” Thin Solid Films, Elsevier Sequoia, vol. 395, No. 1-2, p. 280-283, © 2001.

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