Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2007-02-26
2011-11-08
Vinh, Lan (Department: 1713)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S745000, C438S750000, C156S345110
Reexamination Certificate
active
08053371
ABSTRACT:
A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.
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Patent Abstract of Japan for 09-027482 published Jan. 1997.
Dobson Todd A.
Gordon Brian F.
Hudson Guy F.
Stroupe Hugh E.
Zahorik Russell C.
Micro)n Technology, Inc.
TraskBritt
Vinh Lan
LandOfFree
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