Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-03-25
1999-12-14
Gupta, Yogendra
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
216 93, 438745, 438753, 134 10, 134 43, 134 47, C23F 102
Patent
active
060012161
ABSTRACT:
Semiconductor wafer processing methods and apparatus recirculates etching solution from a lowermost point of a container hosting wafers through a filtration device and back to a point above the location of the wafers within the container. The container includes an inclined bottom wall and an outlet located below an uppermost portion of the inclined bottom wall.
REFERENCES:
patent: 4980017 (1990-12-01), Kaji et al.
patent: 5470421 (1995-11-01), Nakada et al.
patent: 5904572 (1999-05-01), Lee et al.
Gupta Yogendra
Samsung Electronics Co,. Ltd.
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