Apparatus and methods for rerecirculating etching solution durin

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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216 93, 438745, 438753, 134 10, 134 43, 134 47, C23F 102

Patent

active

060012161

ABSTRACT:
Semiconductor wafer processing methods and apparatus recirculates etching solution from a lowermost point of a container hosting wafers through a filtration device and back to a point above the location of the wafers within the container. The container includes an inclined bottom wall and an outlet located below an uppermost portion of the inclined bottom wall.

REFERENCES:
patent: 4980017 (1990-12-01), Kaji et al.
patent: 5470421 (1995-11-01), Nakada et al.
patent: 5904572 (1999-05-01), Lee et al.

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